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Patent Searching and Data


Title:
PRODUCTION METHOD FOR ADHESIVE LAYER-EQUIPPED OPTICAL LAYERED BODY HAVING THROUGH-HOLE
Document Type and Number:
WIPO Patent Application WO/2021/192391
Kind Code:
A1
Abstract:
Provided is a method with which can be produced simply and inexpensively, an adhesive layer-equipped optical layered body having a through-hole and for which the loss of glue and the lifting of a separator and of a surface protection film have been suppressed. According to an embodiment of the present invention, the production method for the adhesive layer-equipped optical layered body having a through-hole comprises stacking a plurality of adhesive layer-equipped optical layered bodies to form a workpiece and forming the through-hole at a predetermined position on the workpiece by cutting using an end mill. The adhesive layer-equipped optical layered body comprises an optical film, an adhesive layer disposed on one side of the optical film, a separator adhered temporarily onto the adhesive layer in a releasable manner, and a surface protection film adhered temporarily onto the other side of the optical film in a releasable manner. The formation of the through-hole comprises pressing the end mill against an end surface of the hole and cutting while moving the end mill in either an upward or downward direction to perform the cutting.

Inventors:
NAKAICHI MAKOTO (JP)
YAMAMOTO YUKI (JP)
Application Number:
PCT/JP2020/041297
Publication Date:
September 30, 2021
Filing Date:
November 05, 2020
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B23C3/00; B23C5/10; B32B1/04; B32B7/023; B32B27/00; C09J7/29; C09J7/38; C09J201/00; G02B5/30
Domestic Patent References:
WO2016203521A12016-12-22
WO2018016285A12018-01-25
Foreign References:
JP6622439B12019-12-18
JP2012096339A2012-05-24
JPS591512U1984-01-07
JP2010076069A2010-04-08
JP2016515716A2016-05-30
JPH11197928A1999-07-27
DE102010029445A12011-12-01
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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