Title:
PRODUCTION METHOD FOR UNEVEN STRUCTURE AND UNEVEN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/194816
Kind Code:
A1
Abstract:
A production method for an uneven structure that involves preparing a resin-filled patterned master plate in which the recesses in a patterned master plate that has a pattern of recesses and protrusions have been filled with a curable resin such that the meniscus of the curable resin that fills the recesses protrudes from the surface of the patterned master plate, preparing an unevenly-shaped substrate on which a cured resin has been formed, aligning the resin-filled patterned master plate and the unevenly-shaped substrate and then curing the curable resin while the meniscus is in contact with the cured resin on the unevenly-shaped substrate, and, after the curable resin has been cured, removing the patterned master plate to produce an uneven structure in which a cured resin that has a shape that corresponds to the pattern of recesses and protrusions of the patterned master plate has been laminated on the cured resin of the unevenly-shaped substrate. A novel uneven structure.
Inventors:
FUCHIGAMI YUJIRO (JP)
ICHIKAWA KENJI (JP)
KUWABARA TAKAYOSHI (JP)
ICHIKAWA KENJI (JP)
KUWABARA TAKAYOSHI (JP)
Application Number:
PCT/JP2019/041274
Publication Date:
October 01, 2020
Filing Date:
October 21, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C59/02; B29C39/10
Domestic Patent References:
WO2013089223A1 | 2013-06-20 |
Foreign References:
JPH02294647A | 1990-12-05 | |||
JP2012252113A | 2012-12-20 | |||
JP2013123884A | 2013-06-24 | |||
US20170050347A1 | 2017-02-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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