Title:
RAISED-AND-RECESSED STRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/194815
Kind Code:
A1
Abstract:
This raised-and-recessed structure production method includes: preparing a base material and a resin-filled pattern master comprising a pattern master having a raised-and-recessed pattern in which the recessed sections have been filled with a curable resin, the menisci of the curable resin filled in the recessed sections protruding from the surface of the pattern master and being present in an isolated state from one another; bringing the base material into contact with the menisci, and in this state, curing the curable resin; and after the curable resin has cured, subjecting the pattern master to mold release. Accordingly, a raised-and-recessed structure comprising the cured resin formed over the base material and having a raised-and-recessed shape corresponding to the raised-and-recessed pattern is produced.
Inventors:
FUCHIGAMI YUJIRO (JP)
ICHIKAWA KENJI (JP)
KUWABARA TAKAYOSHI (JP)
ICHIKAWA KENJI (JP)
KUWABARA TAKAYOSHI (JP)
Application Number:
PCT/JP2019/041273
Publication Date:
October 01, 2020
Filing Date:
October 21, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C39/10; B29C59/02
Domestic Patent References:
| WO2013089223A1 | 2013-06-20 |
Foreign References:
| JP2012252113A | 2012-12-20 | |||
| JP2013123884A | 2013-06-24 | |||
| US20170050347A1 | 2017-02-23 | |||
| JP2008207517A | 2008-09-11 | |||
| JP2002166432A | 2002-06-11 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
Previous Patent: SEE-SAW SWITCH AND ELECTRONIC DEVICE
Next Patent: PRODUCTION METHOD FOR UNEVEN STRUCTURE AND UNEVEN STRUCTURE
Next Patent: PRODUCTION METHOD FOR UNEVEN STRUCTURE AND UNEVEN STRUCTURE