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Title:
PROGRAM, DESIGN METHOD EMPLOYING THE PROGRAM AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/068864
Kind Code:
A1
Abstract:
A pseudo-random curved surface is generated by combining several basic curved surfaces having a size varying randomly, and delay time variation is evaluated by considering it as the system component of variation of elements in an LSI chip. When up to the term of second degree of Legendre polynomial extended to a two-dimensional plane is employed as a basic curved surface, a random curved surface having the degree of freedom of 6 is generated. Consequently, the system component at an arbitrary position can be represented by six variables and a design considering quantitative variation in elements can be achieved with extremely good calculation efficiency.

Inventors:
OKAWA SHINICHI (JP)
Application Number:
PCT/JP2006/324380
Publication Date:
June 12, 2008
Filing Date:
December 06, 2006
Export Citation:
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Assignee:
RENESAS TECH CORP (JP)
OKAWA SHINICHI (JP)
International Classes:
G06F17/50; H01L21/82
Other References:
OHKAWA S. ET AL.: "Analysis and Characterization of Device Variations in an LSI Chip Using an Integrated Device Matrix Array", TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, IEEE, vol. 17, no. 2, May 2004 (2004-05-01), pages 155 - 165, XP011112376
OKADA K.: "Shuseki Kairo ni okeru Seino Baratsuki Kaiseki ni Kansuru Kenkyu", KYOTO UNIVERSITY HAKASE RONBUN, March 2003 (2003-03-01), pages 21 - 29, 55 - 71, Retrieved from the Internet
Attorney, Agent or Firm:
TSUTSUI, Yamato (6th FloorKokusai Chusei Kaikan,Gobancho, Chiyoda-ku, Tokyo 76, JP)
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