Title:
PROTECTIVE-COAT-FORMING COMPOSITE SHEET, AND SEMICONDUCTOR CHIP PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/116278
Kind Code:
A1
Abstract:
A protective-coat-forming composite sheet (101) is provided with a support sheet (10) and a protective-coat-forming film (13) formed on a first surface (10a) of the support sheet (10), wherein the surface resistivity of a rear antistatic layer (17) is set at less than or equal to 1.0×1011 Ω/□, and the frictional force between a porous table and a test piece cut out from the protective-coat-forming composite sheet (101) having undergone heating at 70°C for one minute is set not greater than 20 N.
Inventors:
SAIKI NAOYA (JP)
Application Number:
PCT/JP2019/046361
Publication Date:
June 11, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301
Domestic Patent References:
| WO2017145938A1 | 2017-08-31 | |||
| WO2014069638A1 | 2014-05-08 | |||
| WO2016103902A1 | 2016-06-30 | |||
| WO2017188216A1 | 2017-11-02 |
Foreign References:
| JP2009013183A | 2009-01-22 | |||
| JP2017011199A | 2017-01-12 | |||
| JP2008280520A | 2008-11-20 | |||
| JP2017119749A | 2017-07-06 | |||
| JP2016096239A | 2016-05-26 | |||
| JP2013120839A | 2013-06-17 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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