Title:
PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2018/199173
Kind Code:
A1
Abstract:
This protective film 10 is used adhered on to a resin substrate 21, when thermal-bending the resin substrate 21 under heat. The protective film 10 has a base material layer and an adhesive layer positioned between this base material layer and the resin substrate 21 and adhering to the resin substrate 21. The base material layer comprises a laminate having: a first layer positioned on the opposite side to the adhesive layer, containing a thermoplastic resin, and having a melting point of at least 150°C; and a second layer positioned on the adhesive layer side, containing a thermoplastic resin, and having a melting point of less than 120°C.
Inventors:
ONODERA KAZUFUSA (JP)
Application Number:
PCT/JP2018/016835
Publication Date:
November 01, 2018
Filing Date:
April 25, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B29C51/10; B29C51/14; B29C53/18; B32B27/32
Domestic Patent References:
| WO2014189078A1 | 2014-11-27 | |||
| WO2016080445A1 | 2016-05-26 | |||
| WO2016171223A1 | 2016-10-27 |
Foreign References:
| JP2010275340A | 2010-12-09 | |||
| JP2003145616A | 2003-05-20 | |||
| JP2003145616A | 2003-05-20 |
Other References:
See also references of EP 3616908A4
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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