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Title:
PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/065388
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a provisional fixation material which is able to be easily separated after high-temperature processing even in cases where the high-temperature processing at 300°C or higher is carried out in a state where an adherend is affixed thereby. Another purpose of the present invention is to provide a method for producing an electronic component, said method using this provisional fixation material. The present invention provides a provisional fixation material which contains a photocurable adhesive, wherein: the photocurable adhesive contains a reactive resin which contains a resin (1) that has an imide skeleton as a repeating unit of the main chain; the light transmittance at 405 nm of the provisional fixation material is 10% or more; and the 5% weight loss temperature of the provisional fixation material is 350°C or higher.

Inventors:
DAIDO IZUMI (JP)
TAKAHASHI TOSHIO (JP)
SHICHIRI TOKUSHIGE (JP)
HAYASHI SATOSHI (JP)
HOSHINO FUMIKA (JP)
Application Number:
PCT/JP2021/034877
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C07D207/452; C07D209/48; C07D487/04; C08G73/10; C08K3/013; C08K5/02; C08K5/3415; C08K5/3467; C08L79/08; C08L83/04; C09J4/00; C09J179/08; H01L21/02; H01L21/304
Domestic Patent References:
WO2020137980A12020-07-02
Foreign References:
JP2020525575A2020-08-27
JP2017048266A2017-03-09
JP2012251080A2012-12-20
JP2017222745A2017-12-21
JP2017073541A2017-04-13
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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