Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2015/163276
Kind Code:
A1
Abstract:
Provided is a radiation-sensitive resin composition that contains a binder resin (A), a radiation-sensitive compound (B), and a crosslinking agent (C) represented by the general formula (1), in which the amount of the crosslinking agent (C) contained is 3-25 parts by weight to 100 parts by weight of the binder resin (A). (In general formula (1), R1-R3 are each independently C1-10
hydrocarbon groups.)
Inventors:
SHINDO HIROAKI (JP)
Application Number:
PCT/JP2015/061969
Publication Date:
October 29, 2015
Filing Date:
April 20, 2015
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/004; C08J5/18; C08K5/3475; C08K5/3492; C08L63/00; C08L101/00; G03F7/023
Domestic Patent References:
| WO2011040324A1 | 2011-04-07 |
Foreign References:
| JPH10319591A | 1998-12-04 | |||
| JPH072804A | 1995-01-06 | |||
| JPH11500773A | 1999-01-19 | |||
| JP2013163769A | 2013-08-22 |
Other References:
See also references of EP 3136173A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
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