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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/065350
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition having excellent performance in terms of sensitivity, LWR, etc., in an exposure step even when a next-generation exposure technique is applied; and a method for forming a resist pattern using the composition. This radiation-sensitive resin composition contains: a sulfonium salt compound represented by formula (1); a resin including a structural unit having an acid-dissociable group; and a solvent. (In the formula, Rf1 and Rf2 are each independently an electron-attracting group, and R1 and R2 are each independently an organic group, a hydroxyl group, etc.)

Inventors:
KINOSHITA NATSUKO (JP)
HORI MASAFUMI (JP)
SHIMIZU MASAHIRO (JP)
OMIYA TAKUYA (JP)
Application Number:
PCT/JP2020/033631
Publication Date:
April 08, 2021
Filing Date:
September 04, 2020
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C07C65/03; C07C309/17; C07C309/19; C07D317/70; C07D333/54; C07D333/56; C07D409/04; G03F7/004; G03F7/039; G03F7/20
Foreign References:
CN103288796A2013-09-11
JP2018024652A2018-02-15
JP2018072789A2018-05-10
JP2017107171A2017-06-15
JP2020091476A2020-06-11
JP2019207404A2019-12-05
JP2019207297A2019-12-05
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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