Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN USING SAME, AND SULFONIC ACID SALT COMPOUND AND RADIATION-SENSITIVE ACID GENERATOR COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/220648
Kind Code:
A1
Abstract:
Provided are a method for forming a resist pattern and a radiation-sensitive resin composition which, even when a next-generation exposure technology is applied thereto, have excellent performances concerning sensitivity during exposure steps, LWR performance, etc. The radiation-sensitive resin composition comprises a sulfonic acid salt compound represented by formula (1), a resin including a structural unit having an acid-dissociable group, and a solvent. (In the formula, the Rf moieties are each independently a hydrogen atom, a fluorine atom, a fluoroalkyl group, etc.)
Inventors:
NEMOTO RYUICHI (JP)
MIYAO KENSUKE (JP)
MIYAO KENSUKE (JP)
Application Number:
PCT/JP2021/010568
Publication Date:
November 04, 2021
Filing Date:
March 16, 2021
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C07C309/11; C07C317/06; C07C317/12; C07C317/14; C07C321/16; C07C321/28; C07D307/33; C07D317/72; C07D327/06; G03F7/004; G03F7/038; G03F7/039
Domestic Patent References:
| WO2010123009A1 | 2010-10-28 |
Foreign References:
| JP2009515944A | 2009-04-16 | |||
| JP2011242546A | 2011-12-01 | |||
| JP2003057825A | 2003-02-28 | |||
| JP2012508911A | 2012-04-12 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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