Title:
SOLDER PRE-COAT FORMING APPARATUS AND MOUNTING SUBSTRATE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/220649
Kind Code:
A1
Abstract:
This solder pre-coat forming apparatus (10) includes: a solder paste feeding unit (100) that feeds solder paste to a substrate (1) in a solder paste feeding area PA; a heating unit (210) including a heating device that heats the solder paste fed to the substrate (1) in order to form a solder pre-coat; a first substrate conveying unit (printing stage conveyor (231)) that conveys the substrate (1) in the solder paste feeding unit (100); a second substrate conveying unit (substrate relaying conveyor (232)) that conveys the substrate (1) in a heating area HA where heating is carried out by the heating device; and a control unit that controls the first and second substrate conveying units.
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Inventors:
MANTANI MASAYUKI
Application Number:
PCT/JP2021/010637
Publication Date:
November 04, 2021
Filing Date:
March 16, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K1/00; B23K1/20; B23K3/06; H05K3/34
Foreign References:
| JP2010080695A | 2010-04-08 | |||
| JP2002134894A | 2002-05-10 | |||
| JPH0690079A | 1994-03-29 | |||
| JPH08250853A | 1996-09-27 | |||
| JPH07176859A | 1995-07-14 |
Attorney, Agent or Firm:
KAWASAKI, HASHIMOTO AND PARTNERS (JP)
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