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Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/153296
Kind Code:
A1
Abstract:
Provided are a radiation-sensitive resin composition capable of forming a resist film with excellent sensitivity, LWR performance, water repellency, and suppression of development flaws, and having good storage stability; and a pattern forming method. A radiation-sensitive resin composition comprising a polymer comprising structural units (I) represented by formula (1) and structural units differing from said structural units (I); an onium salt represented by formula (i); and a solvent. (In formula (1), RK1 is a hydrogen atom, a fluorine atom, a methyl group, or trifluoromethyl group. L1 is a 1-5 carbon alkanediyl group. Rf1 is a 2-10 carbon fluorinated hydrocarbon group with 5-7 fluorine atoms.) (In formula (i), Ra1 is a substituted or unsubstituted 1-40 carbon monovalent organic group in which the atom adjacent to the sulfur atom is not bound to a fluorine atom or fluorinated hydrocarbon group. X+ is a monovalent onium cation.)

Inventors:
NEMOTO RYUICHI (JP)
FURUKAWA TAIICHI (JP)
FURUKAWA TSUYOSHI (JP)
INAMI HAJIME (JP)
Application Number:
PCT/JP2023/003312
Publication Date:
August 17, 2023
Filing Date:
February 02, 2023
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C07D307/00; C07D317/72; C07D327/04; C07D327/06; C08F220/18; C09K3/00; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2020105523A12020-05-28
Foreign References:
JP2015147926A2015-08-20
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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