Title:
RADIATION SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMING METHOD AND RADIATION SENSITIVE ACID GENERATOR
Document Type and Number:
WIPO Patent Application WO/2017/179727
Kind Code:
A1
Abstract:
The present invention is a radiation sensitive resin composition which contains a polymer having a first structural unit that contains an acid-cleavable group, a first radiation sensitive acid generator and a solvent, and wherein the first radiation sensitive acid generator is a first compound that has a first ring containing a bridge-like bond and at least two second rings that are fused with the first ring so as to share at least one side. The present invention is also a radiation sensitive resin composition which contains a polymer having a first structural unit that contains an acid-cleavable group, a first radiation sensitive acid generator and a solvent, and wherein the first radiation sensitive acid generator is a compound that is derived from a 1, 4-adduct of a compound having a carbon-carbon double bond or a carbon-carbon triple bond and -CO- or -SO2- to a compound represented by formula (A).
Inventors:
SHIRATANI MOTOHIRO (JP)
Application Number:
PCT/JP2017/015389
Publication Date:
October 19, 2017
Filing Date:
April 14, 2017
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C07C61/29; C07C62/06; C07C309/25; C07C309/27; C07C381/12; C09K3/00; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2015174215A1 | 2015-11-19 |
Foreign References:
JP2010155824A | 2010-07-15 | |||
JP2012229200A | 2012-11-22 | |||
JP2017102267A | 2017-06-08 | |||
JP2002128758A | 2002-05-09 | |||
JP2008308433A | 2008-12-25 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
Download PDF: