Title:
RADIATION-SENSITIVE RESIN COMPOSITION, SPACER, AND METHOD OF FORMING THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/109100
Kind Code:
A1
Abstract:
A radiation-sensitive resin composition which has high sensitivity and high resolution, can readily form a patterned thin film excellent in various performances including pattern shape, compression strength, rubbing resistance, and adhesion to transparent substrates, and is inhibited from emitting sublimates upon burning; a spacer formed from the composition; and a method of forming the spacer. The radiation-sensitive resin composition is characterized by comprising (A) a polymer which has carboxy and epoxy groups and in which the ratio of the weight-average molecular weight (Mw) in terms of polystyrene to the number-average molecular weight (Mn) in terms of polystyrene both measured by gel permeation chromatography, (Mw/Mn), is 1.7 or lower, (B) a polymerizable unsaturated compound, and (C) a radiation-sensitive polymerization initiator.
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Inventors:
KAJITA TORU (JP)
ICHINOHE DAIGO (JP)
SHIHO HIROSHI (JP)
ICHINOHE DAIGO (JP)
SHIHO HIROSHI (JP)
Application Number:
PCT/JP2005/003090
Publication Date:
November 17, 2005
Filing Date:
February 18, 2005
Export Citation:
Assignee:
JSR CORP (JP)
KAJITA TORU (JP)
ICHINOHE DAIGO (JP)
SHIHO HIROSHI (JP)
KAJITA TORU (JP)
ICHINOHE DAIGO (JP)
SHIHO HIROSHI (JP)
International Classes:
G02F1/1339; G03F7/032; G03F7/038; (IPC1-7): G03F7/032; G02F1/1339
Foreign References:
| JP2003107703A | 2003-04-09 | |||
| JP2003295432A | 2003-10-15 | |||
| JP2001261761A | 2001-09-26 | |||
| JP2000319354A | 2000-11-21 | |||
| JP2000081701A | 2000-03-21 | |||
| JPH11133600A | 1999-05-21 | |||
| JP2003041224A | 2003-02-13 |
Attorney, Agent or Firm:
Ohshima, Masataka (BN Gyoen Building 17-11, Shinjuku 1-chom, Shinjuku-ku Tokyo, JP)
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