Title:
RADIO FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2022/007245
Kind Code:
A1
Abstract:
Provided in the present application is a radio frequency module, the radio frequency module comprises a high frequency circuit board, an antenna unit stacked and fixed on one side of the high frequency circuit board, and a connection module used for connecting to an external mainboard; one among the antenna unit and the high frequency circuit board are made from a low-temperature co-fired ceramic technology. Compared to related technology, the radio frequency module of the present application is small in size and easy to process and assemble.
Inventors:
WANG JIANAN (CN)
CHEN YONGLI (CN)
CHEN YONGLI (CN)
Application Number:
PCT/CN2020/123394
Publication Date:
January 13, 2022
Filing Date:
October 23, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H04B1/40; H04B1/38
Foreign References:
| CN109449141A | 2019-03-08 | |||
| CN201966901U | 2011-09-07 | |||
| CN105024154A | 2015-11-04 | |||
| CN1578172A | 2005-02-09 | |||
| KR20080056043A | 2008-06-20 |
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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