Title:
REFLOW FURNACE
Document Type and Number:
WIPO Patent Application WO/2010/064428
Kind Code:
A1
Abstract:
Suitable temperature profiles are reliably applied to a plurality of different kinds of printed boards, respectively. A furnace (0) having a heater (1), and a printed board transfer path (30) arranged over above the heater (1) in the longitudinal direction of the furnace (0) inside the furnace (0) are provided. The transfer path (30) is composed of a first transfer conveyer (31) and a second transfer conveyer (32). The first transfer conveyer (31) is composed of a chain (33) and a chain (34), and the second transfer conveyer (32) is composed of a chain (35) and a chain (36). The printed board transfer speed of the first transfer conveyer (31) and the printed board transfer speed of the second transfer conveyer (32) are differently set. Thus, the suitable temperature profiles are reliably applied to the different kinds of printed boards, respectively.
Inventors:
HIYAMA TSUTOMU (JP)
KADOYASHIKI TOSHIMARU (JP)
KADOYASHIKI TOSHIMARU (JP)
Application Number:
PCT/JP2009/006569
Publication Date:
June 10, 2010
Filing Date:
December 02, 2009
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
HIYAMA TSUTOMU (JP)
KADOYASHIKI TOSHIMARU (JP)
HIYAMA TSUTOMU (JP)
KADOYASHIKI TOSHIMARU (JP)
International Classes:
H05K3/34; B23K1/008
Domestic Patent References:
| WO2006013895A1 | 2006-02-09 |
Foreign References:
| JPH10163623A | 1998-06-19 | |||
| JP2002503161A | 2002-01-29 | |||
| JPH06104563A | 1994-04-15 | |||
| JPH09206927A | 1997-08-12 | |||
| JPH03198980A | 1991-08-30 |
Attorney, Agent or Firm:
YAMAGUCHI, Kunio et al. (JP)
Kunio Yamaguchi (JP)
Kunio Yamaguchi (JP)
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