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Patent Searching and Data


Title:
REFRIGERATION CYCLE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/249424
Kind Code:
A1
Abstract:
This refrigeration cycle system comprises a plurality of refrigeration cycle devices, and a heat transfer medium system for supplying a heat transfer medium to the plurality of refrigeration cycle devices. The refrigeration cycle device includes: a compressor that compresses a refrigerant; a first heat exchanger that is connected to the compressor and performs heat exchange between the refrigerant and the heat transfer medium; an expansion valve that expands and decompresses the refrigerant subjected to heat exchange in the first heat exchanger; a second heat exchanger that is connected to the expansion valve and performs heat exchange between the refrigerant and air; and a load-side blower for blowing air to the second heat exchanger. A heat source device, a pump, and the first heat exchanger constitute a heat transfer medium circuit connected by heat transfer medium piping. The heat transfer medium system includes: the heat source device, which is connected by the heat transfer medium piping to the first heat exchanger and supplies a heat transfer medium; and the pump, which is provided to the heat transfer medium piping and circulates the heat transfer medium supplied from the heat source device to the first heat exchanger and the heat source device. The refrigeration cycle device includes: a detection device that is provided to the heat transfer medium piping and detects the flow rate of the heat transfer medium flowing into the first heat exchanger through the heat transfer medium piping; and a control device that detects that the flow rate of the heat transfer medium detected by the detection device is lower than or equal to a minimum flow rate of the heat transfer medium required for normal operation of the refrigeration cycle device, and controls at least one among the compressor, the load-side blower, and the expansion valve in accordance with the detection that the flow rate of the heat transfer medium is lower than or equal to the minimum flow rate.

Inventors:
ITO TATSUHIKO (JP)
Application Number:
PCT/JP2021/020312
Publication Date:
December 01, 2022
Filing Date:
May 28, 2021
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; F25B49/02
Domestic Patent References:
WO2019058506A12019-03-28
WO2015194020A12015-12-23
Foreign References:
JP2012159251A2012-08-23
CN109253558A2019-01-22
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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