Title:
REINFORCING FILM BONDING DEVICE AND BONDING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/174571
Kind Code:
A1
Abstract:
An ultrasonic wave welding device (70) is disposed facing both surfaces of a fastener chain (11) at a position where a pair of reinforcing film tapes (17) pulled out from a reinforcing film tape guiding means (30) are shifted in the feeding direction of the fastener chain (11) from a position intersecting with the fastener chain (11). A gripper drive means (52) is provided with a servomotor (68) for driving a gripper (51) in the direction in which the reinforcing film tapes (17) are pulled out, and a cylinder device (61) for driving the gripper (51) in the direction of feeding of the fastener chain (11); and a reinforcing film piece (16) to be bonded next is held in a standby position (P3) while a pair of the reinforcing film pieces (16) are being bonded with the ultrasonic wave welding device (70).
Inventors:
UMEKI TAKEHIRO (JP)
Application Number:
PCT/JP2013/061785
Publication Date:
October 30, 2014
Filing Date:
April 22, 2013
Export Citation:
Assignee:
YKK CORP (JP)
International Classes:
A44B19/42
Foreign References:
| JPS58188249A | 1983-11-02 | |||
| JPS57209004A | 1982-12-22 | |||
| JPS6437905A | 1989-02-08 | |||
| JPS4414392B |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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