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Title:
RELAY BOARD
Document Type and Number:
WIPO Patent Application WO/2024/085602
Kind Code:
A1
Abstract:
According to an embodiment of the present disclosure, a relay board for manufacturing a display may comprise: a transparent plate; a transparent buffer material disposed under the plate; and a pattern layer disposed between the plate and the buffer material and including a plurality of patterned holes formed so as to face a plurality of pixel chips of the display.

Inventors:
SEO YEONGHYEON (KR)
KIM JINYOUNG (KR)
LEE BYUNGHOON (KR)
KOO JAMYEONG (KR)
Application Number:
PCT/KR2023/016051
Publication Date:
April 25, 2024
Filing Date:
October 17, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H10K71/00; H05K1/09; H05K3/34; H10K59/123; H10K71/50; H10K77/10
Foreign References:
KR20200126234A2020-11-06
KR20210044430A2021-04-23
KR20220129800A2022-09-26
US20110127664A12011-06-02
KR20190141512A2019-12-24
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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