Title:
RELEASE FILM AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/039157
Kind Code:
A1
Abstract:
This release film has an elongation of 500% or more at 170ºC.
Inventors:
SERI YASUHIRO (JP)
Application Number:
PCT/JP2021/030026
Publication Date:
February 24, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/56
Domestic Patent References:
| WO2017200102A1 | 2017-11-23 |
Foreign References:
| JP2000294579A | 2000-10-20 | |||
| JP2006049850A | 2006-02-16 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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