Title:
RESIN COMPOSITION FOR POWDER LAMINATION SHAPING METHOD, POWDER, SHAPED ARTICLE MANUFACTURING METHOD, AND SHAPED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/039158
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which is for a powder lamination shaping method and in which fusion-bonding of powder during preheating performed for 3D-printer shaping is suppressed; a pellet; a powder; a shaped article manufacturing method; and a shaped article. This resin composition is used for a powder lamination shaping method and contains a phosphorus atom-containing compound and a polybutylene terephthalate-based resin having a structural unit derived from terephthalic acid and a structural unit derived from 1,4-butanediol. When the resin composition is formed into a powder having a particle diameter D50 in the range of 20-80 μm, and when the powder is treated for 1 hour at a temperature lower, by 25℃, than a melting point of the polybutylene terephthalate-based resin measured using differential scanning calorimetry, the shear stress of the powder is 0.30 N/cm2 or less.
Inventors:
SHOJI HIDEKAZU (JP)
KISHISHITA MINORU (JP)
YAMASUE NAO (JP)
KISHISHITA MINORU (JP)
YAMASUE NAO (JP)
Application Number:
PCT/JP2021/030031
Publication Date:
February 24, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
MITSUBISHI CHEM CORP (JP)
MITSUBISHI CHEM CORP (JP)
International Classes:
C08K5/5313; B29C64/153; B33Y70/00; C08G63/183; C08L67/02
Domestic Patent References:
WO2020043573A1 | 2020-03-05 | |||
WO2020138188A1 | 2020-07-02 | |||
WO2016121013A1 | 2016-08-04 | |||
WO2017179139A1 | 2017-10-19 |
Foreign References:
JP2019001154A | 2019-01-10 | |||
JP2018149800A | 2018-09-27 | |||
JP2020037665A | 2020-03-12 | |||
JP6033994B1 | 2016-11-30 | |||
JP2013155279A | 2013-08-15 | |||
JP2017155147A | 2017-09-07 | |||
JP2020084037A | 2020-06-04 |
Other References:
See also references of EP 4201991A4
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF:
Previous Patent: RELEASE FILM AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Next Patent: COIL FOR RFID TAG
Next Patent: COIL FOR RFID TAG