Title:
REPAIR SYSTEM, REPAIR DATA PROVIDING DEVICE AND REPAIR DATA GENERATION METHOD
Document Type and Number:
WIPO Patent Application WO/2015/186751
Kind Code:
A1
Abstract:
This repair system is provided with a repair data providing device and a three-dimensional repair device, and is characterized in that the repair data providing device comprises: a defect site identification unit (12) which identifies the defect site of a repair target by comparing three-dimensional data of the repair target acquired by a scanner and original three-dimensional data of the repair target; a mode selection unit (14) which, depending on the state of the defective surface of the repair target, selects either a first repair mode for repairing only the defect site of the repair target, or a second repair mode for repairing an area that includes the defect site and is wider than said defect site; and a repair data generation unit (16) which generates three-dimensional repair data corresponding to the repair mode selected by the mode selection unit.
Inventors:
YAGITA HIROYUKI (JP)
OKADA YUI (JP)
ISHIKAWA HIROAKI (JP)
HYODO JUN (JP)
ESASHI HIROYUKI (JP)
OKADA YUI (JP)
ISHIKAWA HIROAKI (JP)
HYODO JUN (JP)
ESASHI HIROYUKI (JP)
Application Number:
PCT/JP2015/066080
Publication Date:
December 10, 2015
Filing Date:
June 03, 2015
Export Citation:
Assignee:
MITSUBISHI HITACHI POWER SYS (JP)
International Classes:
B29C67/00; B29C73/00; B33Y50/00
Domestic Patent References:
| WO2010026951A1 | 2010-03-11 |
Foreign References:
| JP2010120104A | 2010-06-03 | |||
| JP2010207884A | 2010-09-24 | |||
| JPH11333574A | 1999-12-07 | |||
| JP2010276491A | 2010-12-09 | |||
| JP2012086235A | 2012-05-10 | |||
| JP2006231409A | 2006-09-07 | |||
| JP2008507412A | 2008-03-13 | |||
| JP2011528075A | 2011-11-10 | |||
| JP2009154176A | 2009-07-16 | |||
| JP2003311463A | 2003-11-05 |
Attorney, Agent or Firm:
SEISHIN IP PATENT FIRM, P. C. (JP)
誠真 IP patent business corporation (JP)
誠真 IP patent business corporation (JP)
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