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Title:
RESIN FOR ADHESIVE SHEET, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/092090
Kind Code:
A1
Abstract:
Provided is a resin for an adhesive sheet that has reliability in joining so as not to peel away or shift, and that can be peeled away during removal without damaging an adherend, even when the resin for an adhesive sheet is affixed to a pliable adherend, an adherend having a brittle surface, or an adherend having low strength. In the provided resin for an adhesive sheet, the storage elastic modulus at 25°C is within the range of 10-500 MPa, the storage elastic modulus at 37°C is within the range of 0.5-20 MPa, and the surface hardness at 37°C is within the range of 0.1-2 MPa.

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Inventors:
HIRANO KEISUKE (JP)
Application Number:
PCT/JP2021/039506
Publication Date:
May 05, 2022
Filing Date:
October 26, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; A61F13/02; C08F20/00; C09J7/22; C09J7/24; C09J7/38; C09J11/04; C09J11/08; C09J131/00; C09J133/06; C09J201/00
Domestic Patent References:
WO2020175220A12020-09-03
WO2019204541A12019-10-24
WO2008056516A12008-05-15
WO2020162247A12020-08-13
Foreign References:
JP2018187359A2018-11-29
JP2020012108A2020-01-23
JP2019203881A2019-11-28
JP2014234460A2014-12-15
JP2020181692A2020-11-05
JP2021075785A2021-05-20
JP6591841B22019-10-16
JP2017039856A2017-02-23
JP2020006166A2020-01-16
JP2019014852A2019-01-31
Other References:
"Polymer Handbook", 1989, JOHN WILEY & SONS
Attorney, Agent or Firm:
OI, Michiko (JP)
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