Title:
RESIN-ATTACHED LEAD FRAME, METHOD FOR MANUFACTURING SAME, AND LEAD FRAME
Document Type and Number:
WIPO Patent Application WO/2012/102266
Kind Code:
A1
Abstract:
A resin-attached lead frame (10) has a plurality of die pads (LED element mounting parts) (25) and a plurality of lead parts (26) provided spaced apart from each of the die pads (25) and is provided with a lead frame main body (11) in which LED element mounting areas (14) are formed on the surface of each die pad (25) and each lead part (26). A reflective resin part (23) is provided so as to surround each LED element mounting area (14) in the lead frame main body (11). An aluminum vapor deposition layer or aluminum sputtering layer (12) is provided on the surface of each LED element mounting area (14) in the lead frame main body (11).
Inventors:
IKENAGA CHIKAO (JP)
ODA KAZUNORI (JP)
ODA KAZUNORI (JP)
Application Number:
PCT/JP2012/051432
Publication Date:
August 02, 2012
Filing Date:
January 24, 2012
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
IKENAGA CHIKAO (JP)
ODA KAZUNORI (JP)
IKENAGA CHIKAO (JP)
ODA KAZUNORI (JP)
International Classes:
H01L33/62; H01L23/48; H01L33/60
Domestic Patent References:
| WO2010026716A1 | 2010-03-11 |
Foreign References:
| JP2008172125A | 2008-07-24 | |||
| JP2006156747A | 2006-06-15 | |||
| JP2007294631A | 2007-11-08 | |||
| JP2004165567A | 2004-06-10 | |||
| JP2005019688A | 2005-01-20 | |||
| JP2011003853A | 2011-01-06 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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Claims:
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