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Title:
RESIN COMPOSITION, ADHESIVE AGENT, ENCAPSULANT, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/181846
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a resin composition which has at least thermosetting properties and with which the bleeding phenomenon can be suppressed; and an adhesive agent.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a surfactant having at least two hydrophilic groups per molecule, the hydrophilic groups being selected from hydroxyl groups and carbonyl groups.

Inventors:
MITSUNUSHI KOKI (JP)
OTSUBO KODAI (JP)
Application Number:
PCT/JP2023/008003
Publication Date:
September 28, 2023
Filing Date:
March 03, 2023
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/02; C08L81/02; C09J4/02; C09J11/00; C09J11/06; C09J181/02; H01L23/10
Foreign References:
JP2021075699A2021-05-20
JP2017101112A2017-06-08
JP2021119224A2021-08-12
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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