Title:
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/181847
Kind Code:
A1
Abstract:
An object of the present invention is to provide at least a thermosetting resin composition and an adhesive that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a rubber component.
Inventors:
MITSUNUSHI KOKI (JP)
Application Number:
PCT/JP2023/008005
Publication Date:
September 28, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/02; C08K3/013; C08L21/00; C08L33/04; C09J4/02; C09J11/04; C09J11/06; C09J133/04; C09J181/02; H01L23/10
Domestic Patent References:
| WO2018078997A1 | 2018-05-03 | |||
| WO2018047849A1 | 2018-03-15 |
Foreign References:
| JPS5463903A | 1979-05-23 | |||
| JP2021134327A | 2021-09-13 | |||
| JP2021075699A | 2021-05-20 | |||
| JP2004155845A | 2004-06-03 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF: