Title:
RESIN COMPOSITION, RESIN ADHESIVE FILM, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/141816
Kind Code:
A1
Abstract:
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or breaking, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.
Inventors:
LIU DONGLIANG (CN)
WANG QING (CN)
TANG JUNQI (CN)
DONG JINCHAO (CN)
WANG QING (CN)
TANG JUNQI (CN)
DONG JINCHAO (CN)
Application Number:
PCT/CN2021/081801
Publication Date:
July 07, 2022
Filing Date:
March 19, 2021
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; C09J11/08; C09J161/06; C09J163/00; C09J179/08; C09J181/06; H05K3/38
Foreign References:
| CN1253970A | 2000-05-24 | |||
| JP2004346256A | 2004-12-09 | |||
| TW201704333A | 2017-02-01 | |||
| CN108893090A | 2018-11-27 | |||
| JP2001072834A | 2001-03-21 | |||
| JP2004359849A | 2004-12-24 | |||
| JPH1135916A | 1999-02-09 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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