Title:
THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/141815
Kind Code:
A1
Abstract:
The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene–butadiene–styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof; C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%–85%, the added amount of said component B is 10%–95%, and the added amount of said component C is 1%–70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
Inventors:
LUO CHENG (CN)
MENG YUNDONG (CN)
YAN SHANYIN (CN)
MENG YUNDONG (CN)
YAN SHANYIN (CN)
Application Number:
PCT/CN2021/081800
Publication Date:
July 07, 2022
Filing Date:
March 19, 2021
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L53/02; B32B15/20; B32B17/04; B32B27/04; B32B27/28; B32B27/32; C08J5/18; C08J5/24; C08K13/02; C08L9/00; C08L71/12; H05K1/05
Foreign References:
| CN112020203A | 2020-12-01 | |||
| CN111372372A | 2020-07-03 | |||
| CN109836631A | 2019-06-04 | |||
| CN111253888A | 2020-06-09 | |||
| CN111253702A | 2020-06-09 | |||
| US20200347219A1 | 2020-11-05 | |||
| JP2019006879A | 2019-01-17 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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