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Title:
RESIN COMPOSITION, BONDING FILM, LAMINATE WITH RESIN COMPOSITION LAYER, LAMINATE, AND ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2022/085563
Kind Code:
A1
Abstract:
A resin composition comprising a polyester-polyurethane resin (A) and an epoxy resin (B), in which an isocyante component constituting the polyester-polyurethane resin (A) comprises an isocynate compound that has a hydrocarbon group having 8 to 14 carbon atoms; and a bonding film, a laminate with a resin composition layer, a laminate, or an electromagnetic wave shield film, in which the resin composition is used.

Inventors:
TORII MASAHIRO (JP)
ANDO MASARU (JP)
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
Application Number:
PCT/JP2021/038077
Publication Date:
April 28, 2022
Filing Date:
October 14, 2021
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
B32B27/40; C08G18/42; C08G18/75; C08K5/544; C08L63/00; C08L75/06; C08L101/08; C09J7/10; C09J7/35; C09J9/02; C09J11/04; C09J163/00; C09J175/06; H05K1/03
Domestic Patent References:
WO2017183608A12017-10-26
WO2017110591A12017-06-29
WO2017204218A12017-11-30
Foreign References:
JP2015110769A2015-06-18
JP2006274258A2006-10-12
JP2015228457A2015-12-17
JP2020164870A2020-10-08
JP2007270137A2007-10-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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