Title:
RESIN COMPOSITION, COPPER FOIL EQUIPPED WITH RESIN, AND COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/189298
Kind Code:
A1
Abstract:
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group consisting of polyamide resins, polyimide resins, and polyacrylic resins; one or more epoxy resins; and a curing agent. Of the two or more polymers, at least one is a polymer having a weight-average molecular weight of 50,000 or greater, and at least one other is a polymer having a weight-average molecular weight of less than 50,000.
Inventors:
OSAWA KAZUHIRO (JP)
MAKINO HARUKA (JP)
OGAWA KUNIHARU (JP)
TAMURA AKINORI (JP)
IIDA HIROTO (JP)
MAKINO HARUKA (JP)
OGAWA KUNIHARU (JP)
TAMURA AKINORI (JP)
IIDA HIROTO (JP)
Application Number:
PCT/JP2023/008657
Publication Date:
October 05, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
B32B15/088; C08G59/20; C08L33/04; C08L63/00; C08L77/00; C08L79/08; H05K1/03
Domestic Patent References:
| WO2020195661A1 | 2020-10-01 | |||
| WO2007004569A1 | 2007-01-11 |
Foreign References:
| JP2012241134A | 2012-12-10 | |||
| JP2018172533A | 2018-11-08 | |||
| JP2004333672A | 2004-11-25 | |||
| JPH05179220A | 1993-07-20 | |||
| JP2003292575A | 2003-10-15 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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