Title:
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/189297
Kind Code:
A1
Abstract:
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin that has a glass transition temperature Tg of 150°C or less, an epoxy resin and a curing agent; and the storage elastic modulus at 200°C of this resin composition in a C-stage state after curing is 10 MPa or more.
Inventors:
OSAWA KAZUHIRO (JP)
MAKINO HARUKA (JP)
OGAWA KUNIHARU (JP)
TAMURA AKINORI (JP)
IIDA HIROTO (JP)
MAKINO HARUKA (JP)
OGAWA KUNIHARU (JP)
TAMURA AKINORI (JP)
IIDA HIROTO (JP)
Application Number:
PCT/JP2023/008656
Publication Date:
October 05, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C08G59/20; B32B15/088; B32B15/092; C08L63/00; C08L79/08; H05K1/03
Domestic Patent References:
| WO2007004569A1 | 2007-01-11 | |||
| WO2020195661A1 | 2020-10-01 |
Foreign References:
| JP2012241134A | 2012-12-10 | |||
| JP2013010961A | 2013-01-17 | |||
| JP2011116968A | 2011-06-16 | |||
| JP2010278324A | 2010-12-09 | |||
| JP2006348086A | 2006-12-28 | |||
| JP2008239867A | 2008-10-09 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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