Title:
RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048435
Kind Code:
A1
Abstract:
Provided are: a resin composition comprising at least one resin selected from the group consisting of a cyclic resin and a precursor thereof and a compound A represented by formula (A-1) in which the total number of carbon atoms in the formula (A-1) is 3 to 30; a cured article; a laminate; a method for producing a cured article; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device. In formula (A-1), R1 represents a monovalent organic group; the site of binding to a nitrogen atom in R1 which is shown in formula (A-1) is a carbon atom; R2 represents a hydrogen atom or a monovalent organic group; R3 represents a monovalent organic group; in which R2 and R3 may be bound to each other to form a cyclic structure.
Inventors:
ASAKAWA DAISUKE (JP)
Application Number:
PCT/JP2023/030662
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; B32B27/34; C08F289/00; C08K5/29; H01L23/12
Domestic Patent References:
| WO2021157306A1 | 2021-08-12 |
Foreign References:
| JPH0841327A | 1996-02-13 | |||
| JP2018111805A | 2018-07-19 | |||
| JPS50100199A | 1975-08-08 | |||
| JP2021181532A | 2021-11-25 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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