Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048436
Kind Code:
A1
Abstract:
Provided are: a resin composition comprising at least one resin selected from the group consisting of cyclic resins and precursors thereof, and compound A corresponding to at least one of compound a1 and compound a2; a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device. Compound a1 has a protected primary amine structure and a specific structure. Compound a2 has a protected primary alkyl amine structure and a specific group.
Inventors:
ASAKAWA DAISUKE (JP)
OZAWA YU (JP)
OZAWA YU (JP)
Application Number:
PCT/JP2023/030663
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; B32B15/088; C07D487/04; C08F289/00; C08K5/205; C08K5/29; C08K5/34; C08K5/35; C08K5/47; G03F7/004; H01L23/29; H01L23/31
Domestic Patent References:
| WO2010114103A1 | 2010-10-07 | |||
| WO2022059622A1 | 2022-03-24 |
Foreign References:
| JP2016212380A | 2016-12-15 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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