Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/065337
Kind Code:
A1
Abstract:
A resin composition comprising a cyclic resin precursor and a compound A, which has a molecular weight of less than 1000 and comprises a plurality of polymerizable groups bonded by linking groups having at least one type of structure selected from the group consisting of cyclohexane structures and acetal structures; a cured product obtained by curing the resin composition; a laminate comprising the cured product; a method for producing the cured product; and a semiconductor device comprising the cured product and the laminate.
Inventors:
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2021/034704
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; B32B15/088; C08F2/44; C08F290/14; C08K5/103; C08K5/3417; C08L79/08; G03F7/027; G03F7/037; G03F7/20
Domestic Patent References:
| WO2012002512A1 | 2012-01-05 | |||
| WO2018155639A1 | 2018-08-30 |
Foreign References:
| JP2010053323A | 2010-03-11 | |||
| JP2009185213A | 2009-08-20 | |||
| JP2011237755A | 2011-11-24 | |||
| JP2009109987A | 2009-05-21 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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