Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/065338
Kind Code:
A1
Abstract:
A resin composition comprising a compound A, which has a molecular weight of less than 1000 and comprises a plurality of polymerizable groups bonded by linking groups having a structure in which at least two ester bonds are directly bonded, and at least one resin selected from the group consisting of cyclic resins and the precursors thereof; a cured product obtained by curing the resin composition; a laminate comprising the cured product; a method for producing the cured product; and a semiconductor device comprising the cured product and the laminate.
Inventors:
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2021/034705
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; C08F2/44; C08F290/00; C08K5/10; C08L79/04; C08L79/08; G03F7/027; G03F7/037; G03F7/20
Domestic Patent References:
| WO2009145158A1 | 2009-12-03 | |||
| WO2010001780A1 | 2010-01-07 | |||
| WO2020054226A1 | 2020-03-19 | |||
| WO2015052885A1 | 2015-04-16 |
Foreign References:
| JP2020154205A | 2020-09-24 | |||
| JP2020152857A | 2020-09-24 | |||
| JP2012514760A | 2012-06-28 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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