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Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/045059
Kind Code:
A1
Abstract:
A resin composition which contains a polyamic acid ester and one or more compounds B that are selected from the group consisting of phosphoric acid esters, phosphoric acid ester amides and phosphoric acid amides; a cured product which is obtained by curing this resin composition; a multilayer body which comprises this cured product; a method for producing this cured product; and a semiconductor device which comprises this cured product or this multilayer body.

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Inventors:
YOSHIDA KENTA (JP)
YAMAGUCHI SHUHEI (JP)
Application Number:
PCT/JP2021/030783
Publication Date:
March 03, 2022
Filing Date:
August 23, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; B32B15/088; C08F290/14; C08G73/10; C08K5/49; C08L79/08
Domestic Patent References:
WO2018003726A12018-01-04
WO2018225676A12018-12-13
WO2019146778A12019-08-01
Foreign References:
JP2007094342A2007-04-12
JP2006309202A2006-11-09
JP2012212003A2012-11-01
Attorney, Agent or Firm:
SIKs & Co. (JP)
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