Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032821
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which contains a resin A that is a cyclized resin or a precursor thereof and a resin B that is an addition polymerization type resin having at least one bond that is selected from the group consisting of a urea bond and a urethane bond; a cured product which is obtained by curing the resin composition; a multilayer body which comprises the cured product; a method for producing the cured product; a method for producing the multilayer body; a method for producing a semiconductor device, the method comprising the method for producing the multilayer body; and a semiconductor device which comprises the cured product or the multilayer body.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/032120
Publication Date:
March 09, 2023
Filing Date:
August 25, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; C08F8/30; C08G73/10; C08L33/04; G03F7/038; G03F7/20
Domestic Patent References:
| WO2020075592A1 | 2020-04-16 | |||
| WO2020138259A1 | 2020-07-02 |
Foreign References:
| JP2022029427A | 2022-02-17 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: