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Title:
RESIN COMPOSITION FOR DISPLAY SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2013/047873
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition for display substrates, which is capable of forming a useful polyimide film that has adequate linear expansion coefficient and adequate flexibility. [Solution] A resin composition for display substrates, which contains the component (A), component (B), component (C) and component (D) described below. Component (A): a polyamic acid which contains a structural unit represented by formula (1) or a polyimide which contains a structural unit represented by formula (2) (In formula (1) and formula (2), X1 represents a tetravalent organic group having an aromatic group and two carbonyl groups; Y1 represents a divalent organic group containing an aromatic group or an aliphatic group; and n represents a natural number.) Component (B): a compound having a carbonyl group and a lower molecular weight than the component (A), or a polymer of the compound Component (C): a crosslinking agent Component (D): a solvent

Inventors:
EBARA KAZUYA (JP)
Application Number:
PCT/JP2012/075375
Publication Date:
April 04, 2013
Filing Date:
October 01, 2012
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08L79/08; C08G59/40; C08G73/10; C08K5/10; C08K5/16; G02F1/1333; G09F9/30; C08L77/00
Domestic Patent References:
WO2008091011A12008-07-31
Foreign References:
JP2007169304A2007-07-05
JP2008297362A2008-12-11
JP2008101187A2008-05-01
JP2007231224A2007-09-13
JP2007169585A2007-07-05
JPH06265910A1994-09-22
JPH06273771A1994-09-30
JP2007262276A2007-10-11
JP2008163210A2008-07-17
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
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Claims:



 
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