Title:
RESIN COMPOSITION FOR FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/053074
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition for a film, with which excellent insulating properties and heat resistance are attained, and which can maintain adhesive strength despite being filled with an insulating filler, and in particular a resin composition for a film with which adhesive strength can be maintained despite being highly filled with a highly heat conductive filler. This resin composition for a film is characterized by including (A) a polyether compound having at both terminals thereof a phenyl group to which a specific vinyl group is bonded, (B) a thermoplastic elastomer, (C) a naphthalene type epoxy resin, (D) a curing agent, and (E) an insulating filler, component (C) being included at a level of 0.5-30.0 mass parts to a total of 100 mass parts of component (A), component (B), component (C), and component (D).
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Inventors:
TAKASUGI HIROSHI (JP)
TOSHIMA JUN (JP)
TERAKI SHIN (JP)
TOSHIMA JUN (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2014/075175
Publication Date:
April 16, 2015
Filing Date:
September 24, 2014
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L71/10; C08G59/20; C08J5/18; C08J7/043; C08K3/00; C08L53/02; C08L63/00; H01L23/373
Domestic Patent References:
| WO2008018483A1 | 2008-02-14 | |||
| WO2014148155A1 | 2014-09-25 |
Foreign References:
| JP2006083364A | 2006-03-30 | |||
| JP2009096840A | 2009-05-07 | |||
| JP2014034668A | 2014-02-24 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
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