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Title:
RESIN COMPOSITION AND INSULATED WIRE
Document Type and Number:
WIPO Patent Application WO/2023/058288
Kind Code:
A1
Abstract:
A resin composition according to one aspect of the present disclosure contains: a polyimide precursor which is the reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine; an organic solvent; and water. The resin composition has a water content of less than 0.5 mass%.

Inventors:
SAITO HIDEAKI (JP)
YAMAUCHI MASAAKI (JP)
MOCHIDA HIROTSUGU (JP)
CUI YUNLONG (JP)
YOSHIDA KENGO (JP)
Application Number:
PCT/JP2022/027474
Publication Date:
April 13, 2023
Filing Date:
July 12, 2022
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC WINTEC INC (JP)
International Classes:
C08L79/08; H01B3/30; H01B7/02
Domestic Patent References:
WO2008059801A12008-05-22
WO2017047778A12017-03-23
WO2020255360A12020-12-24
Foreign References:
JPS61258836A1986-11-17
JP2018048307A2018-03-29
JPH08127715A1996-05-21
JP2005132904A2005-05-26
Attorney, Agent or Firm:
IKEDA Yoshinori (JP)
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