Title:
RESIN COMPOSITION, INSULATING RESIN CURED BODY, LAMINATE, AND CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/189610
Kind Code:
A1
Abstract:
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth) acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, the inorganic ion scavenger comprises both an anion exchanger and a cation exchanger, or an amphoteric ion exchanger, the content of the inorganic ion scavenger is 0.1-50 parts by mass per 100 parts by mass of the total of the thermosetting resin and the copolymer, and the content of the copolymer is 0.01-10 parts by mass per 100 parts by mass of the inorganic filler.
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Inventors:
GONDA YUHEI (JP)
KUMAGAI RYOTA (JP)
ICHIKAWA ISAMU (JP)
NAKAZAWA TOMOHIRO (JP)
KOGURE KATSUMICHI (JP)
NEBASHI IBUKI (JP)
KUMAGAI RYOTA (JP)
ICHIKAWA ISAMU (JP)
NAKAZAWA TOMOHIRO (JP)
KOGURE KATSUMICHI (JP)
NEBASHI IBUKI (JP)
Application Number:
PCT/JP2023/010135
Publication Date:
October 05, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/30; C08K3/01; C08K3/013; C08L63/00; H05K1/03
Domestic Patent References:
| WO2012039324A1 | 2012-03-29 | |||
| WO2009038020A1 | 2009-03-26 | |||
| WO2013030998A1 | 2013-03-07 |
Foreign References:
| JP2017041633A | 2017-02-23 | |||
| JP2017103332A | 2017-06-08 | |||
| JP2016155985A | 2016-09-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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