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Patent Searching and Data


Title:
RESIN COMPOSITION FOR INSULATING LAYER, INSULATED ELECTRICAL WIRE, AND CABLE
Document Type and Number:
WIPO Patent Application WO/2021/015121
Kind Code:
A1
Abstract:
A resin composition for insulating layers according to one aspect of the present invention comprises polymethylpentene as a major component and contains a metal deactivator and an antioxidant, the antioxidant comprising a semi-hindered phenolic antioxidant.

Inventors:
YANAGAWA NAYU (JP)
MACHINAKA SYOTA (JP)
FUJITA TARO (JP)
NISHIKAWA SHINYA (JP)
IZUMI NAOKI (JP)
OKAMOTO TAKAAKI (JP)
OCHI YUJI (JP)
Application Number:
PCT/JP2020/027828
Publication Date:
January 28, 2021
Filing Date:
July 17, 2020
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C08K5/13; C08L23/20; H01B3/30; H01B7/00; H01B11/18
Domestic Patent References:
WO2019082437A12019-05-02
Foreign References:
JP2015168715A2015-09-28
JP2016105406A2016-06-09
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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