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Title:
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/209043
Kind Code:
A1
Abstract:
This resin composition for an underfill material contains a maleimide compound (A) and a secondary monoamino compound (B), wherein said secondary monoamino compound (B) has a boiling point of greater than or equal to 120°C.

Inventors:
TAKIGUCHI TAKENORI (JP)
HIGASHIGUCHI KOHEI (JP)
KIDA TSUYOSHI (JP)
Application Number:
PCT/JP2017/019905
Publication Date:
December 07, 2017
Filing Date:
May 29, 2017
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F22/40; C08K3/00; C08K5/09; C08K5/13; C08K5/17; C08K5/20; C08K5/544; C08L35/00; C09J7/00; C09J11/04; C09J11/06; C09J179/04; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
WO2002102812A12002-12-27
WO2015003220A12015-01-15
WO2014021754A12014-02-06
Foreign References:
JP2014080478A2014-05-08
JP2016065146A2016-04-28
JP2009035710A2009-02-19
JP2008291227A2008-12-04
JPH06157754A1994-06-07
JP2013112730A2013-06-10
JP4587631B22010-11-24
Other References:
See also references of EP 3466992A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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