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Title:
RESIN COMPOSITION FOR LIGHT-REFLECTIVE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/168313
Kind Code:
A1
Abstract:
Provided is a resin composition for a light-reflective component, having excellent continuous molding properties and whereby a light-reflective component having high strength and excellent heat resistance and surface properties (low diffuse reflectance) can be molded. The resin composition for a light-reflective component is obtained by combining and melt-kneading 100 parts by mass polyarylene sulfide resin (A), 0.1-2 parts by mass polyethylene wax having an acid value of 0 (B), 30-70 parts by mass wollastonite having a fiber length of 30-1,000 µm (C), and 70-130 parts by mass powder filler (D). Alternately, the resin composition for a light-reflective component is obtained by combining and melt kneading, in place of component (C), X parts by mass wollastonite having a fiber length of at least 2 µm but less than 30 µm (C-1) and Y parts by mass wollastonite having a fiber length of 100-1,000 µm and a fiber diameter of 5-50 µm, and by fulfilling formulas (1-3). 4/3

Inventors:
OHTAKE FUMIYUKI (JP)
Application Number:
PCT/JP2012/080683
Publication Date:
November 14, 2013
Filing Date:
November 28, 2012
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L81/02; C08K5/5415; C08K7/04; C08K7/16; C08L23/06
Domestic Patent References:
WO2007114056A12007-10-11
Foreign References:
JP2003226810A2003-08-15
JP2002092861A2002-03-29
JP2005171242A2005-06-30
JP2011195824A2011-10-06
JPH0841341A1996-02-13
JPH04334801A1992-11-20
JPH11189719A1999-07-13
JP2007197717A2007-08-09
JP2007262217A2007-10-11
JPH08302190A1996-11-19
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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