RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Title:

RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Document Type and Number:

WIPO Patent Application WO/2015/119218

Kind Code:

A1

Abstract:

Provided are a resin composition that makes it less likely that a molded article obtained therefrom will become cloudy even if the heating temperature in the molding process is a higher temperature, a resin film obtained by molding same, and a stretched film obtained by stretching the resin film. A resin composition containing a methacrylic resin and an aromatic polycarbonate resin, wherein: the methacrylic resin is obtained by polymerizing a monomer component containing 59-90 wt% of methyl methacrylate, 10-40 wt% of a (meth)acrylic acid ester shown by formula (I), and 0.4-0.8 wt% of alkyl acrylate relative to a total of 100 wt% of monomer components; the weight-average molecular weight of the aromatic polycarbonate resin is 20,000-40,000; and the methacrylic resin and aromatic polycarbonate resin content is 50-95 parts by weight of methacrylic resin and 5-50 parts by weight of aromatic polycarbonate resin relative to a total of 100 parts by weight of methacrylic resin and aromatic polycarbonate resin.

Inventors:

DAIMATSU KAZUKI (JP)
NAKAHARA RYO (JP)

Application Number:

PCT/JP2015/053301

Publication Date:

August 13, 2015

Filing Date:

February 05, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SUMITOMO CHEMICAL CO (JP)

International Classes:

C08L33/12; B29C55/02; C08L69/00; G02B5/30; B29C48/00; B29K33/04; B29K69/00; B29L7/00; B29L11/00

Foreign References:

JP2014031459A	2014-02-20
JP2012167195A	2012-09-06
JP2012036264A	2012-02-23
JPH01203450A	1989-08-16
JPH05306344A	1993-11-19

Other References: