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Patent Searching and Data


Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/203038
Kind Code:
A1
Abstract:
Provided are: a resin composition which exhibits excellent laser transmission properties and laser printing properties and which is controlled in terms of transmittance non-uniformity; a molded article, a laser-transmitting resin member, a kit, and a laser-welded article that are obtained using the resin composition; a method for producing a laser-welded article; and a laser marking agent for a resin composition for laser welding. This resin composition for laser marking and laser welding contains 100 parts by mass of a thermoplastic resin, 0.002-10.000 parts by mass of a bismuth compound and a total of 0.1-5.0 parts by mass of two or more types of non-black organic pigment.

Inventors:
SUZUKI TAKAYUKI (JP)
Application Number:
PCT/JP2022/014323
Publication Date:
September 29, 2022
Filing Date:
March 25, 2022
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08L67/00; B23K26/00; B29C65/16; C08K3/22; C08L69/00; C08L101/00
Domestic Patent References:
WO2020013127A12020-01-16
Foreign References:
JPH05254252A1993-10-05
JP2016190451A2016-11-10
JP2016501921A2016-01-21
US20170152372A12017-06-01
JP6183822B12017-08-23
JP2020050822A2020-04-02
JP4157300B22008-10-01
JP4040460B22008-01-30
Attorney, Agent or Firm:
SIKS & CO. (JP)
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