Title:
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/203037
Kind Code:
A1
Abstract:
Provided are a wiring board manufacturing method that enables simple and inexpensive manufacture while ensuring transmission characteristics and electric characteristics of a glass board, and a wiring board. The wiring board manufacturing method comprises: a step A for irradiating laser light from one surface to another surface of a glass board to form a laser reformed portion; a step B for forming a first surface wiring layer including a hydrofluoric acid-resistant metal film and a copper layer on a first surface of the glass board; a step C for etching a surface opposite the first surface to form a through hole in the laser reformed portion, and forming a second surface opposing the first surface of the glass board; a through hole processing step D for removing glass-etching residue attaching to the hydrofluoric acid-resistant metal film; and a step E for forming a through electrode in the through hole.
Inventors:
ISHII TOMOYUKI (JP)
TAKADA TAKEHISA (JP)
UMEMURA YUKI (JP)
TAKADA TAKEHISA (JP)
UMEMURA YUKI (JP)
Application Number:
PCT/JP2022/014307
Publication Date:
September 29, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H05K3/40; H01L23/15; H05K3/00
Domestic Patent References:
| WO2019235617A1 | 2019-12-12 | |||
| WO2016051781A1 | 2016-04-07 | |||
| WO2020116228A1 | 2020-06-11 |
Foreign References:
| JP2013119512A | 2013-06-17 | |||
| JP2002059557A | 2002-02-26 | |||
| US20020084031A1 | 2002-07-04 | |||
| JP2019089082A | 2019-06-13 | |||
| JP2008131037A | 2008-06-05 |
Attorney, Agent or Firm:
PATENT CORPORATE BODY DAI-ICHI KOKUSAI TOKKYO JIMUSHO (JP)
Download PDF: