Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/1994/009070
Kind Code:
A1
Abstract:
A resin composition comprising substantially: (a) 30-70 wt. % of a polyamide resin (component A); (b) 5-40 wt. % of a powdery inorganic filler (component B) mainly comprising a silicate; (c) 10-40 wt. % of a halogen compound (component C); (d) 2-10 wt. % of a pentavalent antimony compound (compound D); and (e) 0-40 wt. % of a filler (component E) other than the component B, a molded article made therefrom, and a product of plating of the article. The molded article not only has an excellent flame retardancy but also can well be plated on its surface.
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Inventors:
OKADA KATSUHIKO (JP)
NISHIJIMA KIYOAKI (JP)
NISHIJIMA KIYOAKI (JP)
Application Number:
PCT/JP1993/001508
Publication Date:
April 28, 1994
Filing Date:
October 20, 1993
Export Citation:
Assignee:
TEIJIN LTD (JP)
OKADA KATSUHIKO (JP)
NISHIJIMA KIYOAKI (JP)
OKADA KATSUHIKO (JP)
NISHIJIMA KIYOAKI (JP)
International Classes:
C08K3/22; C08K3/34; (IPC1-7): C08L77/00
Foreign References:
| JPS62201964A | 1987-09-05 | |||
| JPS63139942A | 1988-06-11 | |||
| JPH03239755A | 1991-10-25 | |||
| JPS5865753A | 1983-04-19 |
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