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Patent Searching and Data


Title:
RESIN COMPOSITION AND RESIN-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/033987
Kind Code:
A1
Abstract:
[Problem] To provide a non-halogen polycarbonate resin composition and a resin-molded article having excellent fire resistance, and physical properties suitable for use as a manufactured product. [Solution] The resin composition of the present invention is provided with a component A, a component B, a component C, and a component D. Component A is a polycarbonate resin. Component B is a talc having an average median diameter of 4.6 μm to 6.0 μm, inclusive, and is 5 wt% to 20 wt%, inclusive. Component C is and organic sulfonic acid or an organic sulfonic acid metal salt, and is 0.05 wt% to 2.0 wt%, inclusive. Component D is a drip inhibitor, and is 0.05 wt% to 1.0 wt%, inclusive.

Inventors:
UEDA KENJI (JP)
INAGAKI YASUHITO (JP)
OHE TAKAHIRO (JP)
YAMADA ATSUSHI (JP)
Application Number:
PCT/JP2013/003691
Publication Date:
March 06, 2014
Filing Date:
June 12, 2013
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
C08K3/34; C08L69/00; C08K5/42; C08L27/18
Foreign References:
JP2005255724A2005-09-22
JP2006124517A2006-05-18
JP2004143410A2004-05-20
JP2005054085A2005-03-03
JPH06223416A1994-08-12
JPH10269634A1998-10-09
JPH10249315A1998-09-22
JP4196862B22008-12-17
JP4196861B22008-12-17
Other References:
See also references of EP 2891682A4
Attorney, Agent or Firm:
OMORI, JUNICHI (JP)
Omori Junichi (JP)
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