RESIN COMPOSITION AND MOLDED ARTICLE

WIPO Patent Application WO/2014/073682

A1

The purpose of the present invention is to provide a resin composition that: exhibits excellent electrical properties, friction characteristics, and chemical resistance; when used in injection molding, prevents delamination; when used in extrusion, eliminates thickness variations and foreign material in extruded articles; and in particular, when used to form thin films, eliminates problems such as tearing. The present invention is a resin composition that contains an aromatic polyether ketone resin (I) and a fluororesin (II) and is characterized in that: said fluororesin (II) is a copolymer of tetrafluoroethylene and a perfluoroethylene unsaturated compound that can be represented by general formula (1) (in which Rf1 represents either -CF3 or -ORf2 and Rf2 represents a C1 - 5 perfluoroalkyl group); the aromatic polyether ketone resin (I) is dispersed inside the fluororesin (II) in the form of particles; the fluororesin (II) constitutes more than 50% but no more than 99% of the combined mass of the aromatic polyether ketone resin (I) and the fluororesin (II); and the mean diameter of the aromatic polyether ketone resin (I) particles dispersed inside the fluororesin (II) is no more than 1 µm. (1) CF2=CF-Rf1

NISHIUMI MASAMI
UEDA YUKI
MASUDA HARUHISA

PCT/JP2013/080439

May 15, 2014

November 11, 2013

Click for automatic bibliography generation  

DAIKIN IND LTD (JP)

C08L27/18; C08L71/10; H01B3/30; H01B3/42; H01B3/44; H01B7/02; H01B13/14

WO2012005133A1

2012-01-12

JPH01301744A	1989-12-05
JP2010189599A	2010-09-02
JP2008511691A	2008-04-17
JPS63118357A	1988-05-23
JP2006274073A	2006-10-12

YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)

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